We Are:At Synopsys, we drive the innovations that shape the way we live and connect. Our technology is central to the Era of Pervasive Intelligence, from self-driving cars to learning machines. We lead in chip design, verification, and IP integration, empowering the creation of high-performance silicon chips and software content. Join us to transform the future through continuous technological innovation.
You Are:You are a seasoned professional with a strong background in thermal engineering, particularly in the context of 3D-IC packaging. Your expertise in thermal analysis and modeling, coupled with your knowledge of thermal conduction, convection, and radiation, makes you an ideal candidate for this role. You have a deep understanding of thermal analysis fundamentals and are adept at setting up simulation environments with proper boundary conditions. Your experience with tools like Ansys ICEPAK and Redhawks SCET is extensive, and you are well-versed in selecting appropriate Thermal Interface Materials (TIM), epoxies, and underfills. You possess excellent organizational and planning skills, and you are a strong communicator, capable of presenting complex technical details effectively. Your collaborative nature allows you to work seamlessly with cross-functional teams, ensuring the successful translation of thermal specifications into design requirements. With a Bachelor's, MS, or Ph.D. in Mechanical, Material Science, or Electrical Engineering and over 5 years of experience in the Thermal Engineering field, you are self-motivated, detail-oriented, and ready to contribute to cutting-edge packaging solutions for leading 3DIC customers in the datacenter, AI/ML space.
What You'll Be Doing:Designing cutting-edge packaging solutions for industry-leading 3DIC customers in the datacenter, AI/ML space.Evaluating design tradeoffs by running thermal simulations to ensure designs are ready for sign-off.Setting up simulation environments with proper boundary conditions for thermal conduction, convection, and radiation.Architecting plans for modeling multiple side-by-side and stacked devices on silicon interposers with chiplets and optical components.Collaborating with Synopsys IP teams to translate thermal specifications into design requirements.Coordinating and partnering with cross-functional teams to ensure successful project execution.The Impact You Will Have:Enhancing the performance and reliability of 3DIC packaging solutions through precise thermal management.Driving innovation in thermal design, contributing to the advancement of datacenter and AI/ML technologies.Ensuring the successful integration of industry-leading IP portfolios into cutting-edge packaging solutions.Improving the efficiency and effectiveness of thermal simulations and analyses.Playing a critical role in the development of next-generation silicon chips and software content.Contributing to the overall success of Synopsys by delivering high-quality designs that meet stringent thermal requirements.What You'll Need:Bachelor's, MS, or Ph.D. in Mechanical, Material Science, or Electrical Engineering.Over 5 years of experience in the Thermal Engineering field.Proficiency in thermal analysis and modeling using tools such as Ansys ICEPAK and Redhawks SCET.Knowledge of material thermal properties and selection of Thermal Interface Materials (TIM), epoxies, and underfills.Experience with system-level thermal simulation of enclosures, airflow, and fluid dynamics.Who You Are:Self-motivated and detail-oriented.Strong organizational and planning skills.Excellent communication and presentation abilities.Collaborative and able to work effectively with cross-functional teams.Innovative and driven to push the boundaries of thermal design.The Team You'll Be A Part Of:You will be joining a dynamic and innovative team focused on designing cutting-edge packaging solutions for leading 3DIC customers. Our team collaborates closely with various Synopsys IP teams to ensure the successful integration of the industry's largest IP portfolio into our packaging solutions. We are dedicated to pushing the boundaries of thermal design and contributing to the advancement of datacenter and AI/ML technologies.
Rewards and Benefits:We offer a comprehensive range of health, wellness, and financial benefits to cater to your needs. Our total rewards include both monetary and non-monetary offerings. Your recruiter will provide more details about the salary range and benefits during the hiring process.
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